仅限于2018年毕业的学生
Job Description – Duties and responsibilities:
In this position as a Signal Integrity Engineer, you will be responsible for definition, analysis and verification of the system interconnect for high speed digital systems of Embedded, PC and mobile chipsets. Your responsibilities will include but not be limited to:
- Interfacing with circuit design, applications engineering, packaging technology, and board design teams to define & implement system interconnect that meet internal specifications and customer requirements.
- Responsible for deliverables, which will include timing assessment, customer design guidelines, IBIS models, package bump/ballout specifications, and developing reference routing for package/board.
- Responsible for and involved in Signal integrity and Power Delivery simulations, signal integrity tools and lab debug/measurements
Qualifications:
You should possess a MS/Phd in Electrical Engineering with knowledge in one of the following areas:
- IO circuits (board, chip and transistor level), high speed digital design, PCB layout, and Package technology.
- Experience in using at least one of extractions/simulation tools such as HFSS/Q3D/Hspice is a must. Experience with lab equipment such as oscilloscopes, network analyzers is required.
- Experience in interfaces such as DDR, Nand, PCIe/USB/SATA or other high speed parallel/serial bus is a plus