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嵌入式软件工程师招聘

放大字体  缩小字体 发布日期:2017-09-26  浏览次数:33452
 行业  IT|通信|电子|互联网  职位  电子技术/半导体/集成电路
 招聘部门    招聘人数  若干
 工作地区  上海  工作性质  全职
 性别要求  不限  婚姻要求  不限
 学历要求  硕士  工作经验  不限
 年龄要求  不限年龄  待遇水平  面议
 更新日期  2025-04-04  有效期至  长期有效
职位描述
内部培训 年终多薪 工作环境好 弹性工作制 五险一金
仅限于2018年毕业的学生Job Title: Software/Senior Software Engineer-WirelessLocation: Shanghai
Justification:
Software/Senior Software engineer is to work on Wi-Fi and Bluetooth software development and platform integration for Marvell Wireless Software Team. Currently, we need more engineers to work on new features, projects, (such as Treepie) and key customer support.
Job Content
1) Develop WiFi and Bluetooth device driver and firmware for Marvell wireless SoCs.
2) Develop WiFi and BT/BLE Coexistence software for Marvell wireless SoCs.
3) Develop system software and applications to enable advanced use cases utilizing Marvell WiFi/Bluetooth technologies.
4) Work on system integration and performance tuning of WiFi/Bluetooth subsystems including WiFi and BT protocol stack on multiple platforms including, Android, Linux and Windows etc.
5) Support Linux open source community for Marvell WiFi/Bluetooth chipsets based software including mwifiex driver etc.
6) Support customers remotely or onsite as needed
Qualifications
1) MS in EE, CE, CS or equivalent is required
2) 3+ year experience after MS is required for senior position.
2) Fluent in English (spoken and written) is required
3) Experience with C programming and debugging is required
4) Knowledge of TCP/IP is required
5) Knowledge of SDIO/USB/PCIE is preferred
6) Knowledge of Wi-Fi/Bluetooth/ Coexistence is preferred
7) Experience with Linux kernel and driver development is preferred
8) Experience with firmware development on embedded system is preferred
 

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公司介绍

仅限于2018年毕业的学生

Job Description – Duties and responsibilities:

In this position as a Signal Integrity Engineer, you will be responsible for definition, analysis and verification of the system interconnect for high speed digital systems of Embedded, PC and mobile chipsets. Your responsibilities will include but not be limited to:
- Interfacing with circuit design, applications engineering, packaging technology, and board design teams to define & implement system interconnect that meet internal specifications and customer requirements.
- Responsible for deliverables, which will include timing assessment, customer design guidelines, IBIS models, package bump/ballout specifications, and developing reference routing for package/board.
- Responsible for and involved in Signal integrity and Power Delivery simulations, signal integrity tools and lab debug/measurements

Qualifications:
You should possess a MS/Phd in Electrical Engineering with knowledge in one of the following areas:
- IO circuits (board, chip and transistor level), high speed digital design, PCB layout, and Package technology.
- Experience in using at least one of extractions/simulation tools such as HFSS/Q3D/Hspice is a must. Experience with lab equipment such as oscilloscopes, network analyzers is required.
- Experience in interfaces such as DDR, Nand, PCIe/USB/SATA or other high speed parallel/serial bus is a plus
 
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