内部培训 五险一金 工作环境好 弹性工作制 年终多薪
仅限于2018年毕业的学生​
Job Title Physical Design EngineerDepartment COT-PD
Location Shanghai, Chengdu China


Job Description
Work with the product design group to provide front- and/or back-end design service for multiple Marvell SOC design groups, with various challenging designs, such as low power, high speed requirements advance technology or ultra-compact die size designs.
Perform some or all of the IC design and implementation, such as design integration, logic synthesis, timing analysis, design for test, physical layout floor planning, power grid design, automatic standard cell placement and routing (APR), clock tree synthesis (CTS), timing closure, power and signal integrity analysis (IR-Drop and EM analysis), layout physical verification (DRC/LVS/Antenna).

? Logic synthesis: including memory replacement, RTL sanity check, std. cell mapping, timing, power, and area optimization, scan stitching, formal verification and signoff.
? Design for test: including DFT spec and partition, BSD/JTAG/MBIST logic generation and insertion, scan chain insertion and pattern generation, simulation and verification, DFT SDC file deliver.
? Physical implementation: including floorplan, power routing, placement, clock tree synthesis, timing closure, routing, si fixing, drc fixing, dfm ...etc
? Physical verification: including low power check, timing analysis, timing eco, xtalk analysis, power analysis, ESD analysis, EM analysis, drc check, lvs check, ant check, erc check ...etc
? Tapeout: timing signoff, power signoff, design tapeout... etc


Job Requirement
? BS or MS in EE or CS from a good university, major in VLSI, logic or CPU design. Good GPA required.
? Hands-on experience in IC design industry or in college is preferred.
? Detail oriented, self-motivated and team player. Good verbal and written communication skills.
? To qualify for the job, you should have some or all of the following technical background:
a. Working knowledge of HDL, such as Verilog , frontend design or SOC integration
       experience, including synthesis, timing analysis, timing constraint creation, and
       formal verification. Experience in Design-for-test (DFT), with JTAG, BIST and
       SCAN.
b. Working knowledge of LEF/DEF and backend physical design, such as floorplanning, standard cell placement and routing or layout integration.
c. Understanding of SPICE model and transistor circuits, and standard cell layouts.
d. IC design methodologies using design automation EDA tools, ASIC design flow, and deep sub-micron technology issues.
e. Familiarization with scripting programming, such as Tcl or Perl. Experience with
       makefile and understanding of the design automation for efficiency.
f. Working experience with any of the EDA tools listed below:
       i. Synopsys: IC Compiler, StartRC, PrimeTime, PT-SI, PrimeRail, Formality,
                   Hercules, Design Compiler, TetraMAX)
       ii. Cadence: EDI, SOC Encounter, Nanoroute, Celtic, Verplex, RC
       iii. Magma: Talus, Blast
       iv. Mentor: Calibre, TestKompress, FastScan, MBIST, BSD
       v. Ansys: Apache Redhawk

仅限于2018年毕业的学生​

Job Description – Duties and responsibilities:

In this position as a Signal Integrity Engineer, you will be responsible for definition, analysis and verification of the system interconnect for high speed digital systems of Embedded, PC and mobile chipsets. Your responsibilities will include but not be limited to:
- Interfacing with circuit design, applications engineering, packaging technology, and board design teams to define & implement system interconnect that meet internal specifications and customer requirements.
- Responsible for deliverables, which will include timing assessment, customer design guidelines, IBIS models, package bump/ballout specifications, and developing reference routing for package/board.
- Responsible for and involved in Signal integrity and Power Delivery simulations, signal integrity tools and lab debug/measurements

Qualifications:
You should possess a MS/Phd in Electrical Engineering with knowledge in one of the following areas:
- IO circuits (board, chip and transistor level), high speed digital design, PCB layout, and Package technology.
- Experience in using at least one of extractions/simulation tools such as HFSS/Q3D/Hspice is a must. Experience with lab equipment such as oscilloscopes, network analyzers is required.
- Experience in interfaces such as DDR, Nand, PCIe/USB/SATA or other high speed parallel/serial bus is a plus